Lithography

EVG620NT, the newest mask aligner to be added to NNFC's optical Lithography bay incorparates NIL technology in addition to mask alignment

Spin Coater is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for spin coat Polymers.

EVG 501 Wafer Bonderhas the capability of Bonding 4" wafers. The machine allows Anodic bonding, Eutectic bonding and Fusion bonding. Aligning wafer stack on EVG620 Mask aligner and anodically bonding the wafer stack on EVG bonder is also possible.

Model:WS-650MZ-23NPP, S.No:11615

Laurell Spin Processor is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for all E-Beam Photoresists only.

(Model: WS-650MZ-23NPP, S.No:11615)

Laurell Spin Processor is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for only Negative Photoresists and PDMS.

(Model:WS-650MZ-23NPP, S.No:11615)

Laurell Spin Processor is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for only Positive Photoresists.

An optolithography technique in which a laser beam/ LED is used to form the desired patterns on the photoresist is called laser /LED writing (Direct writing). 

The specialty of the Mask Writer is that it can be used for direct pattern generation on any substrate using photolithographic principles with or without using a conventional mask plate. The main purpose of the Mask writer is to make photolithographic mask reticles and masks up to 5inch in Heidelberg µPG 501 system.