Lithography

Details of Clean Room Equipments in National Nano Fabrication Center Class 100, used during Standard Lithographic Processes such as Spinning Photoresist, Photoresist Baking, E-Beam Lithography, Mask Generation, UV Lithographic Exposure, Development and Lithography Resources.

List of chemicals available in Lithography bay can be found here

Spin Coater (Inside the Glove Box)

Spin Coater

Spin Coater is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for spin coat Polymers.

EVG 501 Wafer Bonder

EVG 501 Wafer Bonderhas the capability of Bonding 4" wafers. The machine allows Anodic bonding, Eutectic bonding and Fusion bonding. Aligning wafer stack on EVG620 Mask aligner and anodically bonding the wafer stack on EVG bonder is also possible.

Laurell Spin Processor 3

Model:WS-650MZ-23NPP, S.No:11615

Laurell Spin Processor is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for all E-Beam Photoresists only.

Laurell Spin Processor 2

(Model: WS-650MZ-23NPP, S.No:11615)

Laurell Spin Processor is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for only Negative Photoresists and PDMS.

Laurell Spin Processor 1

(Model:WS-650MZ-23NPP, S.No:11615)

Laurell Spin Processor is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for only Positive Photoresists.

Heidelberg uPG 501

An optolithography technique in which a laser beam/ LED is used to form the desired patterns on the photoresist is called laser /LED writing (Direct writing). 

The specialty of the Mask Writer is that it can be used for direct pattern generation on any substrate using photolithographic principles with or without using a conventional mask plate. The main purpose of the Mask writer is to make photolithographic mask reticles and masks up to 5inch in Heidelberg µPG 501 system. 

Microtech LW-405

An optolithography technique in which a laser beam/ LED is used to form the desired patterns on the photoresist is called laser /LED writing (Direct writing). 
 
The specialty of the Mask Writer is that it can be used for direct pattern generation on any substrate using photolithographic principles with or without using a conventional mask plate. The main purpose of the Mask writer is to make photolithographic mask reticles and masks up to 5inch in Microtech LW-405 system.

EVG 620

EVG620 is a "SEMI-AUTOMATIC" Contact Photo-Lithographic Alignment and Exposure Tool. It also has the Capability of Front to Back Alignment of Patterns and Aligning wafer stack for the Anodic bonder. Recipes for different Exposure types and Contact Modes can be Pre-Written and is very User friendly. The equipment for Optical Lithography allows for selectively masking and exposure of certain areas of the sample substrate using a ”MASK” and ”SET OF MASK”. Masks are realized in advance by Laser Writer by Etching a Thin Metallic Layer deposited onto a special Glass Slide.

MJB4

Suss MicroTec Mask aligner is a "SEMI-AUTOMATIC" Contact Photo-Lithographic Alignment and Exposure Tool with the above mentioned Specifications. It also has the Capability of Front to Back Alignment of Patterns. Recipes for different Exposure types and Contact Modes can be Pre-Written and is very User friendly.

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