Heidelberg DWL66+ is a direct writing lithography tool which is capable of writing up to 9” substrate size. It is equipped with 405nm Diode Laser. The tool can resolve a minimum feature size of 600nm (Isolated Line) and 800nm of line with a pitch of 1.6µm. Front to Back Alignment and Grayscale exposure with 128 gray levels can be performed in the tool.