Chemical Wetbench HF Vapor Phase Etcher is used for striction free silicon dioxide etching in microfabrication.
Process Capability
HF vapor phase etcher is used for Silicon dioxide etching using HF vapors which is a quasi-dry process.
Tool Capability
– Wafer temperature that can be adjusted from 35°C to 60 °C to regulate etch rates -Electrostatic or mechanical clamping options -Sample size from 1×1 cm pieces to full 6 inch wafers
This section will be updated soon.
Chemical Wetbench Solvent/bases is used for solvent clean/ Si etch of samples coming from lithography or other level 3 equipments.
Process Capability
All processes using Acetone, IPA or methanol. This bench is for metal liftoff, Litho mask cleaning and KOH silicon etch (LEVEL 3), Separate glassware for processing substrates containing Gold.
Tool Capability
The Chemical Wetbench Solvent/bases has 2 different solvent baths to do dedicated cleans. Also, it has petridishes and ultrasonic bath for lift off process. Heater and beakers are provided for KOH etch of cut pieces. The bench is also fitted with a dump rinser and dryer. The baths are capable of cleaning 25 full 6 inch wafers simultaneously.
This section will be updated soon.
Chemical wet bench Acid clean is used for cleaning of unprocessed, new cut pieces to full 4 inch Si wafers.
Process Capability
RCA/piranha of non-preprocessed (new) & wafers going into First nano furnaces, oxide and oxynitride etch of samples only from First nano furnaces or RTP2.
Tool Capability
Quartzware and PP petridishes for processing substrates going to/ coming from Level 1 equipments.
This section will be updated soon.
Chemical Wetbench Acid clean is used for cleaning up to 6 inch full, unprocessed silicon wafers.
Process Capability
RCA/ Piranha of full, unprocessed wafer going into First Nano Level 1 furnaces. The cleans performed here are high quality; final cleans which precede high temperature processing.
Tool Capability
The CMOS pre cleaning bench has 4 different acid baths to do dedicated processes. Also, it has a dump rinser and dryer to avoid the physical contaminants. The baths are capable of cleaning 25 full 6 inch wafers simultaneously.
This section will be updated soon.
Chemical wet bench Acid Metal is used for processing substrates with metals or exposed to metals.
Process Capability
Piranha/Metal etching/oxide etching of samples containing metal or processed in PECVD/ any LEVEL 3 equipment, Electroplating of Gold, Separate glassware for processing substrates containing Gold, Cleaning of glass slides.
Tool Capability
The Chemical wet bench Acid Metal has 5 different acid baths to do dedicated processes . Also, it has a dump rinser and dryer to avoid the physical contaminants. The baths are capable of cleaning 25 full 6 inch wafers simultaneously.
This section will be updated soon.
Chemical wet bench Acid semi-clean is used for processing substrates coming from/ going to Level 2 equipments.
Process Capability
RCA/piranha of post-processed wafers from equipments in Level 2, oxide and nitride etching of samples processed in PECVD after chamber clean, samples from lithography which is not contaminated by metals.
Tool Capability
The Chemical wet bench Acid Metal has 5 different acid baths to do dedicated processes. Also, it has a dump rinser and dryer to avoid the physical contaminants. The baths are capable of cleaning 25 full 6 inch wafers simultaneously.
This section will be updated soon.
Chemical Wetbench General (BULK processes) is used for oxide clean/ Si etch of samples containing metals including gold.
Process Capability
Si etch using KOH/TMAH with Gold contamination, nitride/ oxide etching of samples containing metal or processed in PECVD without chamber clean.
Tool Capability
The Chemical Wetbench Solvent/bases has 5 different acid baths to do dedicated processes. The bench is also fitted with a dump rinser and dryer. The baths are capable of processing cut pieces to 25 full 6 inch wafers simultaneously.
This section will be updated soon.
Chemical wet bench Solvents/ bases semi-clean is used for solvent clean and Si etch of cut pieces to full 4 inch wafers.
Process Capability
All processes using Acetone, IPA or methanol. Allows stripping of photoresist from non-metal contaminated samples and Si etch using TMAH.
Tool Capability
Quartzware and PP pertidishes for processing substrates going to/ coming from Level 2 or Level 1 equipments.
This section will be updated soon.
This section will be updated soon.
This section will be updated soon.
Process Capability
Tool Capability
This section will be updated soon.
