National Nano Fabrication Centre
ISO 9001:2015, ISO 14001:2015 and ISO 45001:2018 Facility
Indian Institute of Science Bangalore
- Home
- About
- Our Team
- Facilities
- Lithography
- Dry Etch
- Wet Processing
- Chemical HF Vapouriser WB
- Chemical Wetbench (Solvents/bases) Level 3
- Chemical Wetbench Acid Clean – Level 1
- Chemical Wetbench Acid Clean (Bulk Processes) – Level 1
- Chemical Wetbench Acid Metal Level 3
- Chemical Wetbench Acid Semi-Clean- Level 2
- Chemical Wetbench General (BULK processes) LEVEL 3
- Chemical Wetbench Solvents/ Bases Semi-Clean – Level 2
- Critical Point Dryer_Tousimis
- Deposition
- AJA Sputter coater
- Atomic Layer Deposition_Beneq
- Drive-In and Annealing Furnaces
- E-Beam Evaporator (LEYBOLD)
- E-beam Evaporator (TECPORT)
- Epitaxial Silicon CVD
- ICPCVD_Oxford
- Low Pressur CVD
- Oxidation and Diffusion Furnaces
- PECVD_ Oxford (OI)
- Rapid Thermal Anneal Sys1
- Rapid Thermal Anneal Sys2
- Sputter Coater1 Metals_Tecport
- Sputter Coater2 Dielec_Tecport
- Tempress Annealing System
- Inline Characterization
- NNFC Annexe
- ABM Mask Aligner_Annexe1
- Acid Hood (Annexe 2)
- Anelva RF Sputtering – Annexe-1
- Anelva RIE System-Annexe-1
- Chemical Mechanical Polishing (CMP -Annexe-1)
- E-Beam Evaporator_Annex
- HHV Co-Sputter Oxide tool _Annexe 3
- HHV Glove Box Sputtering_Annex
- HHV Sputter Coater 2- Annexe 1
- HHV Sputter Metal Coater1- Annexe 1
- HHV Sputter Tool (Nitride)_Annexe 3
- Lindberg Furnace (Annexe-1)
- Optical Lithography-EVG 620
- Solvent Hood (Annexe 2)
- Vacuum Annealing Tool (Annexe1)
- VR Tech Sputter Tool – Annexe-1
- VR Tech Thermal Evaporator_Annex
- Safety and Policies
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