ICPRIE from Plasmatherm is dedicated to etching materials like PZT, AlN etc. The tool which has both chlorine and fluorine chemistries available is also used to etch novel materials which are currently not allowed in other RIE's at NNFC
Etch non-uniformity of <=5%
within wafer, and <=3% wafer to wafer
surface roughness <=2nm
•Sio2 etch rate ~300nm/min
•Sputter etch using Argon
•Anisotropic etch profile is feasible
