Skip to main content
  • NNFC Internal
  • Equipment Booking
  • Career
  • Contact Us

Search form

Home
  • About NNFC
    • History of the fab
    • Mission and Vision
    • Organisation
  • People
  • Academic Users
    • How to become an user (IISc)
    • How to access the facility (other academic institutes)
    • Student internship
    • Cleanroom terms and conditions
  • Industry Interaction
    • Industry interaction model
    • Proof-of-concept support
    • Fabrication and characterisation service
    • Payment process
  • Safety and Policies
    • Safety in the Cleanroom
    • Contamination Protocol
  • Research
    • Research Overview
    • Research Areas
    • Research Highlights
    • Publications
  • NNFC Resources
    • Equipment
      • Lithography
      • Dry Etch
      • Wet Processing
      • Deposition
      • Inline Characterisation
      • In-house Development
      • Process Integration
    • Booking and Usage
    • Process Technology
    • Cleanroom Information
    • Process Request
Home NNFC Resources Equipment

Equipment

  • Lithography
    • E-beam Lithography
      • Raith e-Line
      • Raith Pioneer
    • Optical lithography
      • MJB4
      • EVG 620
    • Microtech LW-405
    • Heidelberg µPG 501
    • Spin Coaters
      • Laurell Spin Processor 1
      • Laurell Spin Processor 2
      • Laurell Spin Processor 3
    • EVG 501 Wafer Bonder
  • Dry Etch
    • ICP-RIE
      • RIE-Cl
      • RIE-F
    • Deep-RIE
  • Wet Processing
    • Chemical Wet Bench Acid Clean
    • Chemical wet bench Acid Metal
    • Chemical wet bench Acid semi-clean
    • Chemical wet bench Solvents/ bases semi-clean
    • Chemical Wetbench General (BULK processes)
    • Chemical Wetbench HF Vapor Phase Etcher
    • Chemical Wetbench Solvent/ bases
    • Chemical Wetbench Pre-clean (BULK processes)
  • Deposition
    • Sputter Deposition
      • Sputter Coater 1 Metals
      • Sputter Coater 2 Dielectrics
    • E-beam evaporator (TECPORT)
    • PECVD
    • Atomic layer deposition (ALD)
    • Furnace Processing
      • Low Pressure CVD
      • Oxidation & Diffusion Furnace
      • Drive-in and Annealing
      • Rapid Thermal Anneal system 1 (RTP)
      • Rapid Thermal Anneal system 2 (RTP)
    • SPF-332H Multi-Cathode Sputtering System
    • Thermal Evaporator System
  • Inline Characterisation
    • Ellipsometer
    • KMOS Ultra Scan
    • Four Point Probe
    • Dektak-XT
  • In-house Development
    • Critical Point Drier (CPD)
    • Tempress Single Stack Furnace
    • Tempress Three Stacked Furnace
  • Process Integration

Equipment

NNFC

A list of all NNFC equipments as per their FOM desgination and their respecitive tool owners is given below.

Quick Links

  • CeNSE Website
  • INUP
  • MNCF
  • NNFC Wafer Request
  • NNFC Consumables Request
  • Visitors Request Form
  • User Feedback
  • NNFC tool and process capabilities
  • NNfC/MNCF Technical Information Request Form
  • Memento Request Form
  • NNFC Brochure

Quick Links

  • Health and Safety

  • NNfC Equipments

  • Equipment Booking

  • NNfC Quick Facts

Contact Us

Centre for Nano Science and Engineering 

Indian Institute of Science, 

Bangalore - 560 012 

Phone: +91-80-2293-3276/3291

(c) National Nanofabrication Centre, CeNSE, IISc, 2018.