Tempress Three Stacked Furnace dedicated for dielectric annealing and Oxidation, at the temperatures ranges between (350°C to1000°C). The process is carried out at atmospheric pressures.
Critical Point Drying(CPD) is used for anti striction and dried release of delicate MEMS/NEMS structure after wet etch in a most beneficial method using Liquid Carbon dioxide(LCO2) at gaseous state.
