Furnace Processing

Rapid Thermal Anneal system 2 (RTP)

System for oxidation and oxy-nitridation carrying gases O2, N2, N2O and Ar. This is a MOS clean system and wafers processed here should never have gone through a metal deposition step, even if the metal has been removed. Wafers should come from Level 0 / 1 wet benches only.

Rapid Thermal Anneal system 1 (RTP)