Plasma Enhanced Chemical Vapour Deposition (PECVD)

Plasma Enhanced Chemical Vapour Deposition (PECVD) utilizes plasma to enhance the reaction of the precursors. It is a low temperature process when compared to conventional Chemical Vapour Deposition (CVD). It uses RF energy to generate plasma where the deposition can be done below 380C. The deposited material will be conformal in nature. The deposition rate is high compared to conventional CVD. The deposited material can have smooth surface. The deposited material will always be amorphous in nature.

Contamination Level: 

•       Substrate size: Deposition can be done on wide variety of sample (i.e., even polymer samples, glass samples and silicon substrates, small cut pieces to 8” wafer).

•       Multiple depositions can be done like stack deposition.

•       Dielectric materials like SiOx, SiNx, SiOxNy, GeOx.

•       Semiconductor materials like a-Si, Ge, SiGe can be deposited.

•       Phosphorus and boron doped oxide films can be deposited.

•       Stoichiometry of the deposited material can be controlled.

•       Film stress can be controlled by high/low frequency mixing techniques

  • Maximum deposition temperature : 3800C

  • Minimum deposition temperature : 1000C

  • High Frequency RF Generator:13.56 MHz ,600W

  • Low Frequency RF Generator: 350KHz-500W

  • Top electrode :RF driven (MHz and/or kHz).

  • Bottom Electrode: No RF Bias ( substrate).

  • Gases used are H2, SiH4, GeH4, CH4, NH3, CF4, N20, N2, Ar, 2%B2H6/Ar, 1%PH3/Ar.

  • Wafers or carrier plate up to 150mm dia.

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Days: 2nd of each month

Slot timing: 15:00 till 17:00 Hours


User should undergo three practice sessions apart from the training slot, he/she is supposed to book the training slots and get their own sample.

Users are requested to submit the online training form (at least a day prior to the training slot) given in the link below.

Authorization of the user will depend upon a test conducted by the tool owner or technology manager.

Before starting of the training user should go through the training document/manual (see tool operating manual link below).

After the process is done; authorized users must enter the login/process details in the excel sheet which is at the cleanroom Dry Etch computer desktop.

Incase authorized users misuse the tool or breach the dry etch/cleanroom protocols authorization will be cancelled.