RIE-F

Dry Etch
ICP-RIE

Reactive Ion Etching (RIE) is an etching technology used in micro and nano fabrication wherein plasma is used to remove materials deposited on the substrate. Plasma is generated under low pressure by electromagnetic field. High energy ions from the plasma attack the wafer surface and react with it to remove the film. PlasmaLab system 100 ICP 180 is a Reactive Ion Etching tool from Oxford Instruments.

  • Films that can be etched on RIE-F: Si, Ge, SiGe, Oxide, Nitride, Carbide, Polymer, and other Dielectrics.
  • Separate RF and ICP generators provide separate control over ion energy and ion density, enabling high process flexibility.

  • Gases on Fluorine-based module: H2, O2, Ar, N2, SF6, CF4, CHF3, C4F8

  • 3 KW, 2 MHz RF generator for 415V 50 Hz ICP 380 source

  • RF powered lower electrode- 600 W, 13.56 MHz generator

  • Helium assisted cooling for heat transfer

  • Julabo heater/Chiller unit for temperature from -30°C to +80°C

  • Wafer or Carrier Plate up to 150mm dia

  • 2,3,4,6 inch Quartz Clamp

  • Laser Interferometer 675nm, End Point Detector

Day: 1st and 3rd Tuesday of every month

Slot timing: 14:30 to 17:00 Hours

 

Training Rules

  • Online Training Form:- Users are requested to submit the form available in the user groups/FOM.
  • Training document/manual:- Users are requested to go through the Tool SOP/Videos present in the user groups before attending the training.
  • “Hands on Training” will be given by the tool owner for the Users.
  • Practice Session:-
    • Practice slots must be booked by the User only on Working Days during Working Hours (10:00 a.m. to 1:00 p.m. or 2:00 p.m. to 5:00 p.m.).
    • Maximum of 2 Practice Slots are allowed per week.
      • Practice Slots must be booked on alternate days within a week.
      • Maximum of 1 slot per day is allowed.
    • Practice Sessions must be done only under the tool owner's supervision.
    • Minimum of 3 Practice Slots are required to be done before authorization.
    • “Day Time Access”:- User will be given this access until he/she completes the training and practice sessions successfully.
  • “Any Time Access”:- User will be given this access depending upon his/her performance at the end of the final practice session.
    • No. of Practice Sessions may be extended if necessary.
  • “Tool Log Book Entry”:- For every process run, the User must enter the Process details and the Etch results in the Tool Log Book.
  • Authorization will be CANCELLED in case the User is found to misuse the tool or breach the dry etch/cleanroom protocols.

 

(c) National Nanofabrication Centre, CeNSE, IISc, 2018.