Angstrom Thermal Evaporator System

Organic material deposition requires uniform and precise heating with excellent temperature and deposition rate control. This is commonly achieved using a source similar to an effusion furnace. In an effusion type source, evaporation of the target material occurs via electrical (Joule) heating of a refractory metal filament coiled around a alumina, ceramic, or quartz crucible. The crucible is heated above the melting or sublimation point of the source material to create adequate vapour pressure for deposition.

Make: Angstrom engineering Nexdep thermal Evaporator

Ultimate Pressure         : 4.3×10-7mbar

Maximum Power         : 150V (Applied in terms of %)

Thickness Range         : 5-150nm

 

Deposition Uniformity                                      : 10%

Materials list Allowed                                           : Al, Ag, Au, Alq3, MoO3, LiF, V2O5, BCP, CuPc,

Materials list that can be processed (deposited)   : Alq3, MoO3, BCP, CuPc, Al, Ag, LiF, V2O5, Au

Deposition Rate                              : 1-10A°/Sec

Distance from Source to Sample   : up to 10cm

Substrate Heater                              :  up to 200°C

 

Substrate Maximum Size allowed  : 3 inch in dia or 70×70 mm

Substrate rotation                             : 2-10 rpm

Make: Angstrom engineering Nexdep thermal Evaporator

Ultimate Pressure         : 4.3×10-7mbar

Maximum Power         : 150V (Applied in terms of %)

Thickness Range         : 5-150nm

 

Deposition Uniformity   : 10%

Materials list Allowed  : Al, Ag, Au, Alq3, MoO3, LiF, V2O5, BCP, CuPc,

Materials list that can be processed (deposited)   : Alq3, MoO3, BCP, CuPc, Al, Ag, LiF, V2O5, Au

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How to apply - link to form (Internal): As per request through FOM