SPF-332H Multi-Cathode Sputtering System

Sputter deposition is a physical vapour deposition process for depositing thin films, sputtering means ejecting material from a target and depositing it on a substrate such as a silicon wafer. The target is the source material. Substrates are placed in a vacuum chamber and are pumped down to a prescribed process pressure. Sputtering starts when a negative charge is applied to the target material causing a plasma or glow discharge. Positive charged gas ions generated in the plasma region are attracted to the negatively biased target plate at a very high speed. This collision creates a momentum transfer and ejects atomic size particles from the target. These particles are deposited as a thin film into the surface of the substrates. Magnetron sputtering can be done either in DC or RF modes.