Sputtering is one of the most widely used techniques for depositing thin films. The target is a plate of the materials to be deposited or the material from which a film is synthesized. Because it is connected to the negative terminal of a dc or RF power supply, the target is also known as the cathode. Typically, several kilovolts are applied to it. The substrate that faces the cathode may be grounded, electrically floating, biased positively or negatively, heated, cooled, or some combination of these. After evacuation of the chamber, a gas, typically argon, is introduced and serves as the medium in which a discharge is initiated and sustained. Gas pressures usually range from a few to 100mtorr. After a visible glow discharge is maintained between the electrodes, it is observed that current flows and that a film condenses on the substrate. In vacuum, of course, there is no current flow and no film deposition. Microscopically, positive ions in the discharge strike the cathode plate and eject neutral target atoms through momentum transfer. These atoms enter and pass through the discharge region to eventually deposit on the growing film. In addition, other particles (secondary electrons, desorbed gases, and negative ions) as well as radiation (X-rays and photons) are emitted from the target.
Days: First and second Wednesdays, every month.
Slot timings: 5 PM to 9 PM
Fill up Training Form to apply for tool training.
User has to attend the training sessions and then book the slots for practice. (At least 3 parctice slots)
Then after user will be an authorized independent user.
Once you are an independent user you are supposed to book and use only the after office hours slots.
