Spin Coater is used to distribute Photoresist in a unifrom layer by spinning a Substrate. This spin processor is used for spin coat Polymers. A typical process involves depositing a small puddle of a fluid substrate onto the centre of a substrate and then spinning the substrate at high speed. Final film thickness and other properties will depend on the nature of the fluid (viscosity, drying rate, per cent solids, surface tension, etc.) and the parameters chosen for the spin process. Factors such as final rotational speed, acceleration, and fume exhaust contribute to how the properties of coated films are defined.
Make: Suss Microtech Model: DELTA6RC, glovebox integrated configuration
Maximum spin speed: 7000rpm
Multiple steps: Possible, programmable
Holding capacity: 3” wafer
Spin chamber : Nylon
Office Hours, Mon-Friday, as per request.